SOLDER PASTE INSPECTION EQUIPMENT PRINTED CIRCUIT BOARD (PCB) INSPECTION EQUIPMENT IN-LINE AND STAND ALONE UNITS LaserVision as well as CyberOptics

LaserVision SP3D (NEW)

The LaserVision SP3D combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of SMT stencil printing. The SP3D with ADC automatically calculates height, width, length, area and volume on all solder paste features in the system's field of view.

This eliminates operator subjectivity, the most common variable associated with manual solder paste measurement.  With its Windows 98® interface, the SP3D is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields...More Details here >>

 

SMT SOURCE Internationally connected with the PCB Manufacturer/End User, Dealer and Refurbishing shops to provide a wide range of equipment and systems to the Electronic Production Industry.


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.: CyberOptics® SE 200 100% 3D  (In-line Inspection) :.

Year

Pix

EMAIL US

Sampled Solder Paste Inspection SE 200 provides an affordable alternative to expensive board scanning systems, offering the same benefits - repeatability and continuous process monitoring - at a fraction of the cost.

SE 200 calculates true volume based on 3D measurements, producing more precise, repeatable results than 2D systems.

Typically the SE 200 performs 100% 3D inspection of 13 x 13, 50 mil pitch BGA site in 8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site takes approximately 12 seconds.

2000

Re-Conditioned w/warrantee

CyberOptics®
SE200

 

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.: CyberOptics® Sentry2000  (In-line Inspection) :.

Year

Pix

EMAIL US

The CyberOptics® Sentry2000 allows for in-line performance at an affordable price.  The system can be placed either in front of or behind the conveyor line, depending on your line layout.

Key Benefits

  • Inspects multiple sites selected by user. e.g BGA, Discreet and Fine Pitch
  • .7sec per measurement location
  • In-line Inspection
  • SMEMA Compatible
  • Fully Programmable
  • Height, Area and Volume Measurements
1999

re-conditioned w/warrantee &
w/SE 200 software upgrade

CyberOptics® Sentury2000

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.: CyberOptics® Sentry2  (In-line Inspection) :.

Year

Pix

EMAIL US

The CyberOptics® Sentry2 is a cost effective method for systematically monitoring the printing process to achieve continuous, in-line statistical process control.

Key Benefits

  • 2.5 seconds per measurement location

  • In-line Inspection

  • SMEMA Compatible

  • Fully Programmable

  • Height, Area and Volume Measurements

1995 - 1996

re-conditioned w/warrantee

CyberOptics®

 

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.: CyberOptics® LSM  (Off-line Inspection) :.

Year

Pix

EMAIL US

The CyberOptics® LSM allows your company to start monitoring your printing process within hours of receiving it.  Operators are easily trained to take paste height and width measurements on various types of solder pads.  This system utilizes a single laser stripe and triangulation technology to calculate the measurements.

Key Benefits

  • Small Initial Investment = Fast ROI

  • Height and Width Measurements

  • Minimal Operator Training Required

1991 - 1997

re-conditioned w/warrantee

CyberOptics® LSM

 

 

[Product Image]

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.: CyberOptics® LSM 300  Auto (Off-line Inspection) :.

Year

Pix

EMAIL US
The LSM300 follows the successful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system. LSM300 provides automatic height measurements, eliminating the inconsistencies of manual measurements and substantially improving repeatability. Additional to the height measurement the LSM300 provides dimensional x- / y-measurements, as well as area- and volume data of various pad forms. Due to the adjustable magnification level with variable measurement range and powerful software tools the LSM300 is useful for many SMT specific application. The most common usage is measuring the wet solder paste immediately after printing. Stencil apertures can also be measured. After reflow solder joints are easily examined.
Accurate and repeatable results, combined with various analysis and documentation possibilities, such as integrated SPC, make the LSM300 an effective and economical SMT-Inspection system.

Buy Sell or Consign SMT Assembly machines and equipment. If your company is looking for Quality Pre-Owned PCB/Surface mount Equipment, or would like recover capital from your unused inventory, We can help!