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Sampled Solder Paste Inspection SE 200 provides an
affordable alternative to expensive board scanning systems,
offering the same benefits - repeatability and continuous process
monitoring - at a fraction of the cost.
SE 200 calculates true
volume based on 3D measurements, producing more precise,
repeatable results than 2D systems.
Typically the SE 200
performs 100% 3D inspection of 13 x 13, 50 mil pitch BGA site in
8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site
takes approximately 12 seconds.
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2000
Re-Conditioned w/warrantee
CyberOptics®
SE200
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